By Preeti S Chauhan,Anupam Choubey,ZhaoWei Zhong,Michael G Pecht
This serious quantity presents an in-depth presentation of copper twine bonding applied sciences, techniques and gear, besides the industrial merits and dangers. Due to the expanding rate of fabrics used to make digital elements, the electronics has been speedily relocating from excessive fee gold to seriously lower price copper as a cord bonding fabric. However, copper twine bonding has numerous method and reliability matters as a result of its fabric houses. Copper cord Bonding booklet lays out the demanding situations considering exchanging gold with copper as a twine bond fabric, and contains the bonding procedure changes—bond strength, electrical flame off, present and ultrasonic strength optimization, and bonding instruments and gear adjustments for first and moment bond formation. In addition, the bond–pad metallurgies and using naked and palladium-coated copper wires on aluminum are awarded, and gold, nickel and palladium floor finishes are mentioned. The booklet additionally discusses most sensible practices and suggestions at the bond procedure, bond–pad metallurgies, and applicable reliability exams for copper wire-bonded digital components.
In precis, this book:
- Introduces copper twine bonding technologies
- Presents copper twine bonding processes
- Discusses copper cord bonding metallurgies
- Covers fresh developments in copper cord bonding together with the bonding technique, apparatus adjustments, bond–pad fabrics and floor finishes
- Covers the reliability assessments and concerns
- Covers the present implementation of copper twine bonding within the electronics industry
- Features a hundred and twenty figures and tables
Copper cord Bonding is an important reference for execs looking specified info on all points of copper cord bonding technology.
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